Technical Literature

Dicing Blade

TOTALLY NEW “POROUS DICING BLADE” FOR A VARIETY OF DICING APPLICATIONS NANO TEM CERAMIC-BOND DIAMOND DICING BLADE

A Comprehensive Hubless Dicing Blade. The versatile blade, the best performance on high speed cutting for soft material AS WELL AS hard and brittle material dicing applications such as:

• PCB (LED Packages) - FR4 and BT Resin
• PBGA - FR4 and Epoxy Molding
• Tape Heads and Magnetic Heads - Ferrite and TiC
• QFN - Copper and Epoxy Molding
• Hybrid Substrates and Ceramic Packages - Alumina, AlN and Zirconia
• Crystal material - Sapphire, SiC and Silicon
• Saw Devices - LiTaO3, LiNbO3 and Quartz
• Optical Devices (IR Cut Filters) - Glass
• Glass related materials - Glass and Silicon

Note: We have a long time experience on dicing and grooving Sapphire Substrate. Please contact us, if you are interested in cutting sapphire.

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Though NOT Resin-bond Blades, Nickel-bond Blades nor Sintered Metal-bond Blades. BUT WHY SO WIDE RANGE?! BECAUSE:

Porous structure with 40 vol% porosity:

Porous ceramic-bonded structure with 40 volume% porosity maintains large diamond edge protrusion, resulting in high removal rate. This DOES NOT limits applicable materials. Ceramic-bond, which strongly catches and fastens every single diamond grains, realizes endurances, resulting in exceptionally long blade life. Porous structure, like diamond grains networking structure each other with bonding material, holds coolant inside pores and deliver it efficiently to the contacting points between diamond grains and work piece material. As a result, the coolant cools heat generated by friction and maintains the sharp diamond edge to cut. Porous ceramic-bond is the matrix to create networking structure for SELF-SHARPENING and exposing new diamonds: Diamond grains with dull edge go off easily from the matrix because of friction generated by itself (dull edge), and create chances for new diamond grains coming out.

Starting from TEST-CUT

Our blades are tested extensively on the latest platforms. Standing upon the wide variety of dicing experiences, blades are customized depending upon customer’s specific requirements and results from test-cuts. Let Nano TEM test and challenge to satisfy your sophisticated requirements and specifications through the procedure below:

• (a) Supply work piece materials that you encounter to overcome on dicing
• (b) Supply blades that you use or plant to use for dicing materials (a)
• (c) Inform your requirements and specifications on dicing
• (d) Conduct test-cut and compare you blade and NANO TEM blade
• (e) Report test-cut results and propose the best suitable blade

Notes: Please mention, if you need NDA to start the procedure above. We do so straightforwardly. Let us get started!!

Common requirements for dicing blade

Blades are designed to match customer’s specific requirements. Test cuts help to find out desired blade. Let us test!

• High removal rate
• No blade meandering during dicing
• High edge quality (minimized chipping size)
• Maintain constant removal rate (no removal rate deterioration)
• Electrical conductivity for set up

Features “Focusing on high removal rate and edge quality”

1. Applications

Grooving (Half cut)

2. Differences and remarkable points compared with other manufacturers

Ceramic-bond type diamond blade

Maintain constant removal rate due to 40 volume % porous structure

Suitable for dicing hard and brittle materials such as sapphire, quartz, silicon substrate, etc.

Example: Sapphire substrate grooving dicing with NanoTEM blade

Comparison between NanoTEM blade and metal / resin bond blade

Nano-TEM's ceramic bond blade	Metal / Resin bond blade
Consist of diamond grains, pores and ceramic bond	Consist of diamond grains and metal or resin bond
[Features] High removal rate Pores play the role of chip pocket and coolant water circulation	[Features] Long life