Technical Literature

• Homogenous pores and internal vacuum circuit make uniform chucking all over the top surface.
• This helps highly sophisticated Semiconductor, LCD or PCB manufacturing process to achieve precise products, higher yield and even your advanced demands.
• Nano TEM vacuum chuck is customized to all kind of substrates made of silicon, glass, ceramics and plastics, and promises that the substrate is fastened as flat as possible.
• The top surface is selected in round or rectangular dependent on the substrate shape.
• Manufacturing from 100 to 2000mm in diameter, and from 100x100 to 2200x2500mm.

Features

• Liquid phase sintering technology makes porous ceramic with less particle risk from its inside to the environment.
• For your sophisticated application, porosity and average pore size are changed to meet your demand. Starting from making samples, customers can test the samples and change the specifications step by step.
• Large sized vacuum chucks have been fabricated as LCD manufacturing equipment tables up to Generation 8 size.
• Round shape, 2000mm in diameter can be fabricated by Nano TEM own facilities.
• Separated areas with individual vacuuming ports realize chucking a group of multi-sized substrates with ONE Chuck Table.
• Selecting vacuuming ports with valves, some of separated areas are selected according to the substrate size. There is no need to prepare many of chuck table for multi-sized substrate.
• Because of high porosity, pressure loss is low when exhausting inside of a chuck table. Therefore, chucking strength is high compared with lower porosity chucks (with high pressure loss when exhausting) under the same vacuum facility condition.
  Caution: Chucking strength deteriorates if substrate size is smaller than top surface of chuck due to low pressure loss.
• This porous chuck is applicable for grinding in wet condition (exposed to water solved coolant and even lapping or polishing slurry) because of its high porosity. Typical applications are silicon wafer back-side grinding and LCD glass substrate grinding, lapping and polishing. Grinding chuck top surface is so-called “Self-Grinding”. This makes grinding wheel surface and chuck top surface “parallel”.
• After the self-grinding, a work-piece is fixed to the chuck, ground, and the parallel is transcribed to the work-piece as its geometry in consequence. This is so-called “Transcription of Parallel”. Using a rotary joint, this chuck can be rotated during chucking.
  Caution: Porous chuck with low porosity is NOT applicable in wet condition. Chucking ability deteriorates steeply and as a result, work-piece moves off and causes damages to the work-piece and machine itself.
• This porous ceramic chuck is able to fasten no matter whether a magnetic or diamagnetic body.
• A regulator performs an important role of controlling surface morphology of the films or substrate during chucking.
• This porous ceramic has density from 1.6 to 1.8, lighter than aluminum alloy. This porous ceramic is available in the shape of plate, block, pipe and bar with your specified dimensions (length, width and thickness). You can make your own chuck by yourself, and use this porous ceramic as a structural material (part) with your ideas.