Korea agency of Nano-TEM: KIMEI T&C
Nano-TEM's
  • Manufacturing porous ceramic applied products such as vacuum chuck for semi-conductor, flat panel display and printed circuit board industries, specialized in large scale and customizing, simple ceramic plate, air floating nozzle, and light weight structural parts.
  • Manufacturing diamond powder applied consumables such as dicing blade, fixed abrasive (pellet) lapping plate, backside grinding (cup) wheel, specialized used in ceramic substrates industry such as AlN and Al2O3and sapphire substrate related industry such as blue and white LED.
  • Process services of grinding, lapping, polishing and dicing on a variety of hard and brittle materials such as ceramics, glass substrates and crystal materials.
Technology
Porous Ceramics Chuck Porous Ceramics Vacuum Chuck
With 40 micrometer pores in average, a substrate is fastened onto the chuck surface without dimples. Good at customizing and manufacturing in large scale.
ダイシングブレード Precise Cutting Technology
(Dicing Blade)
Suitable for dicing hard and brittle materials such as ceramic and crystal substrates such as Al2O3, AlN, sapphire and so on. Variety from 0.1 to 1 mm in thickness. Outer and inner diameters can be freely customized by customer’s specific requirement.
ダイヤモンド砥石 Precision Diamond Grinding Wheel
Since diamond part is harder than core part (e.g. GC part), the latter wears faster than the former and the former slightly keeps protruding to work piece to grind. With 40vol% of porosity, the diamond wheel lets water through itself and gives sufficient coolant effect directly to work piece and diamond grains.
研削研磨 Grinding Machines
(The Grinder, NRG2000)
As a result of continuous effort on developing next generation grinding technology, NanoTEM grinding machines provide new solutions for semi-conductor and flat panel display industries that keep growing and expanding.
Information

*Information list